Customizing a semiconductor wafer involves multiple steps to prepare it for device fabrication. Below are the key processes:
- Choosing Specifications: Selecting material, doping type, size, thickness, and resistivity based on device requirements.
- Surface Preparation: Polishing and cleaning the wafer to ensure uniformity and cleanliness.
- Material Deposition: Applying thin films using techniques like Chemical Vapor Deposition (CVD) or Physical Vapor Deposition (PVD).
- Photolithography: Creating intricate patterns on the wafer using light-sensitive photoresist and UV light exposure.
- Etching: Removing unwanted material through wet or dry etching to define the device structure.
- Doping and Implantation: Adding impurities to control electrical properties in specific regions.
- Metallization: Depositing metals like copper or aluminum to form interconnects.
- Testing and Packaging: Testing functionality and dicing the wafer into individual chips for integration.